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Fingerprint sensors packaging substrate manufacture supporting

HongRuiXing (Hubei) Electronics Co.,Ltd.
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Fingerprint sensors packaging substrate manufacture supporting

Brand Name : Horexs

Certification : UL

Place of Origin : china

MOQ : 1 square meter

Price : US 120-135 square meter

Payment Terms : L/C, D/P, T/T, Western Union, MoneyGram

Supply Ability : 30000 square meters per month

Delivery Time : 7-10 working days

Packaging Details : carton customized

Material : BT

Soler Mask : Taiyo

Color : Mate Black and Green

Thickness : 0.2mm

Sureface Teartment : Gold Plating

Gold Thickness : 3-5u"

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Application:IoT electronics,Home electronics,Consumer electronics,Car electronics,Smart electronics;

Spec.of Substrate production:

Mini.Line space/width:1mil (25um)

Finished thickness:BT (0.1-0.4mm) finished thickness;

Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;

Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;

Copper:0.5oz or Customize;

Layer:1-6 layer (Customize);

Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK,ABQ)

Fingerprint sensors packaging substrate manufacture supporting

Short introduction of Horexs Manufacturer:

HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.

When you send inquiry us,Pls be know that we have to get the following :

1-Substrate production sepc. information;

2-Gerber files(Substrate designer/engineer can export it from your layout software,also send us drilling file)

3-Quantity request,Including sample;

4-Multilayer Substrate,please also provide us layer stack-up/Buildup information;

Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need! HOREXS 's mission is that help you save cost with same high quality guarantee!

Want Better price,Better quality Substrate ? Contact Horexs now!

Shipping supporting:


By air;

Customize express(DHL/UPS/Fedex)

Product Tags:

0.2mm Fingerprint Recognition PCB


0.2mm PCB Multilayer Fabrication


Gold Plating Fingerprint Recognition PCB

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