Sign In | Join Free | My
China HongRuiXing (Hubei) Electronics Co.,Ltd. logo
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified Supplier

4 Years

Home > Sensors Substrate >

Semiconductor sensors substrate manufacture

HongRuiXing (Hubei) Electronics Co.,Ltd.
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment

Semiconductor sensors substrate manufacture

Brand Name : Horexs

Model Number : NC-02

Certification : UL

Place of Origin : china

MOQ : 1000pieces

Price : US 0.1-0.12 each piece

Payment Terms : L/C, D/P, T/T, Western Union, MoneyGram

Supply Ability : 30000sqm/ month

Delivery Time : 7-10 working days

Packaging Details : carton customized

type : IC Substrate

Material : BT

finished : gold plating

Contact Now

Application:Fingerprint recognition electronics,IoT electronics,Semiconductors ,Semiconductor,IC package,Consumer electronics,Car electronics;

Spec.of Substrate production:

Mini.Line space/width:1mil (25um)

Finished thickness:0.17mm;

Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;

Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;

Copper:0.5oz or Customize;

Layer:1-6 layer (Customize);

Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK,ABQ)

Semiconductor sensors substrate manufacture

Short introduction of Horexs Manufacturer:

HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.

When you send inquiry us,Pls be know that we have to get the following :

1-Substrate production sepc. information;

2-Gerber files(Substrate designer/engineer can export it from your layout software,also send us drilling file)

3-Quantity request,Including sample;

4-Multilayer substrate,please also provide us layer stack-up information;

Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need! HOREXS 's mission is that help you save cost with same high quality guarantee!

Want Better price,Better quality Substrate ? Contact Horexs now!

Shipping supporting:


By air;

Customize express(DHL/UPS/Fedex)

Product Tags:

Fingerprint Recognition PCB Board Fabrication


UL Fingerprint Recognition PCB


Fingerprint Recognition PCB For Intelligent Lock

Cheap Semiconductor sensors substrate manufacture for sale

Semiconductor sensors substrate manufacture Images

Inquiry Cart 0
Send your message to this supplier
*To: HongRuiXing (Hubei) Electronics Co.,Ltd.
Characters Remaining: (0/3000)