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HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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4 Years

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Camera / Bluetooth / Wireless Module Substrate BT 4L 0.21mm Soft Gold Finished

HongRuiXing (Hubei) Electronics Co.,Ltd.
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Camera / Bluetooth / Wireless Module Substrate BT 4L 0.21mm Soft Gold Finished

Brand Name : Horexs

Model Number : GC-01

Certification : UL

Place of Origin : china

MOQ : 1000pieces

Price : US 0.089-0.109 each piece

Payment Terms : L/C, D/P, T/T, Western Union, MoneyGram

Supply Ability : 30000sqm/ month

Delivery Time : 7-10 working days

Packaging Details : carton customized

type : module substrate

Material : BT

finished thk. : 0.21mm

finished : soft gold

Layer : 4L

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Camera/Bluetooth/Wireless Module substrate manufacture

Application:Semiconductor package,Wireless modules,Power AMS module,Bluetooth module,Camera module,IC package,WIFI module/Bluetooth module,Others;

Camera / Bluetooth / Wireless Module Substrate BT 4L 0.21mm Soft Gold Finished

Camera / Bluetooth / Wireless Module Substrate BT 4L 0.21mm Soft Gold Finished

Spec.of Substrate production:

Mini.Line space/width:1mil (35um)

Finished thickness:0.21mm;

Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;

Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;

Copper:0.5oz or Customize;

Layer:1-6 layer (Customize);

Buildup:1+2+1/2+2+2;

Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK,ABQ)

Short introduction of Horexs Manufacture:

HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.

When you send inquiry us,Pls be know that we have to get the following :

1-Substrate production sepc. information;

2-Gerber files(Substrate designer/engineer can export it from your layout software,also send us drilling file)

3-Quantity request,Including sample;

4-Multilayer Substrate,please also provide us layer stack-up/Buildup information;

Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need! HOREXS 's mission is that help you save cost with same high quality guarantee!

Want Better price,Better quality Substrate ? Contact Horexs now!

Shipping supporting:

DHL/UPS/Fedex;

By air;

Customize express(DHL/UPS/Fedex)


Product Tags:

4L Wireless Module substrate

      

BT Wireless Module substrate

      

Soft Gold Module substrate

      
Cheap Camera / Bluetooth / Wireless Module Substrate BT 4L 0.21mm Soft Gold Finished for sale

Camera / Bluetooth / Wireless Module Substrate BT 4L 0.21mm Soft Gold Finished Images

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