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HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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Flip Chip CSP Package Substrate 5x5mm Green Color BT Material

HongRuiXing (Hubei) Electronics Co.,Ltd.
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Flip Chip CSP Package Substrate 5x5mm Green Color BT Material

Brand Name : Horexs

Certification : UL

Place of Origin : china

MOQ : 1 square meter

Price : US 85-100 per square meter

Payment Terms : L/C, D/P, T/T, Western Union, MoneyGram

Supply Ability : 30000 square meters per month

Delivery Time : 7-10 working days

Packaging Details : carton customized

Material : BT

Thickness : 0.3mm

Size : 5*5mm

Color : Green

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Flip Chip CSP package substrate production supporting

Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electronics,Computer,PC/Server : DRAM, SRAM,Smart Mobile Devices ,AP, Baseband, Finger print sensor, etc.Network : Bluetooth, RF, others;

Applicable up to 35µm pitch for flip-chip assembly (peripheral)
Thin build-up laminate for SiP applications (0.3mmt for 1-2-1)
Applicable environmentally-friendly products (Halogen-free, Lead-free)
Various surface finish options are available
(Au plating, Lead-free solder coating, OSP, etc.)

Flip Chip CSP Package Substrate 5x5mm Green Color BT Material

Spec.of Substrate production:

Mini.Line space/width:1mil (25um)

Finished thickness:0.3mm;

Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;

Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;

Copper:0.5oz or Customize;

Layer:1-6 layer (Customize);

Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK,ABQ)

Flip Chip CSP Package Substrate 5x5mm Green Color BT Material

Flip Chip CSP Package Substrate 5x5mm Green Color BT Material

Short introduction of Horexs Manufacturer:

HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.

When you send inquiry us,Pls be know that we have to get the following :

1-Substrate production sepc. information;

2-Gerber files(Substrate designer/engineer can export it from your layout software,also send us drilling file)

3-Quantity request,Including sample;

4-Multilayer Substrate,please also provide us layer stack-up/Buildup information;

Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need! HOREXS 's mission is that help you save cost with same high quality guarantee!

Want Better price,Better quality Substrate ? Contact Horexs now!

Shipping supporting:

DHL/UPS/Fedex;

By air;

Customize express(DHL/UPS/Fedex)


Product Tags:

CSP package substrate

      

5x5mm CSP package substrate

      

BT FCCSP Package Substrate

      
Cheap Flip Chip CSP Package Substrate 5x5mm Green Color BT Material for sale

Flip Chip CSP Package Substrate 5x5mm Green Color BT Material Images

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